Processes, Vol. 11, Pages 857: Mechanism of Surface Wettability of Nanostructure Morphology Enhancing Boiling Heat Transfer: Molecular Dynamics Simulation

Processes, Vol. 11, Pages 857: Mechanism of Surface Wettability of Nanostructure Morphology Enhancing Boiling Heat Transfer: Molecular Dynamics Simulation

Processes doi: 10.3390/pr11030857

Authors: Wenting Guo Liangcai Zeng Zhuoyuan Liu

In this paper, the interaction mechanism between the solid–liquid–gas interface phenomenon caused by nanostructure and surface wettability and boiling heat transfer is described, and the heat transfer theory of single wettable nanostructure surface and mixed wettable nanostructure surface is proposed. Through molecular dynamics simulation, the thermodynamic model of the wettable surface of nanostructures is established. The nanostructures are set as four rectangular lattice structures with a height of 18 Å. The solid atoms are platinum atoms, and the liquid atoms are argon atoms. The simulation results show that with the increase of surface hydrophilicity of nanostructures, the fluid temperature increases significantly, and the heat transfer at the interface is enhanced. With the increase in surface hydrophobicity of nanostructures, the atoms staying on the surface of nanostructures are affected by the hydrophobicity, showing a phenomenon of exclusion, and the evaporation rate in the evaporation area of nanostructures is significantly increased. In addition, the mixed wettable surface is influenced by the atomic potential energy and kinetic energy of the solid surface, and when compared with the pure wettable surface under the nanostructure, it changes the diffusion behavior of argon atoms on the nanostructure surface, enhances the heat transfer phenomenon compared with the pure hydrophobic surface, and enhances the evaporation phenomenon compared with the pure hydrophilic surface. This study provides insights into the relationship between the vapor film and the heating surface with mixed wettability and nanostructures.